Products

H7510M 80 μm Heat Resistant Carrier Tape

Features

● High temperature resistance, low shrinkage, acid and alkali resistance.

● Easy to strip, free from contamination and without residual glue.

● Easy to attach, no bubbles. It is stable after attaching.


Structure

6203_Eng.jpg

Adhesive

Total Thickness(mm)

Release Film(mm)

Width (mm)

Acrylic

0.08

0.025

Max 1000

 


Applications

● For FPC high temperature process, acid and alkali process, no crimp, no residual glue.

● For ITO glass, high temperature protection, no residual glue.


Properties

Test Items

Test Value

Test Method

Adhesion to Steel (g/25mm)

7

JISZ0237 8

Initial Tack J.DOW (0~32#)

<3#

JISZ0237 12

Shrinkage(180℃,30min)

MD

< 0.5

 Thermal Shrinkage Tester

TD

< 0.1

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