Products

5P120A Back Grinding Tape

Features

● With a high coverage of the circuit surface, it prevents scattering of the wafers and the infiltration of grinding water during polishing.

● Highly clean and extremely low ion impurities.

● Moderate hardness, effective absorption of vibration and stress and reducing fragmentation.

● With excellent thickness uniformity.


Structure

5P165U_Eng.jpg

Adhesive

Total Thickness(mm)

Release Film(mm)

SPEC

Acrylic

 0.12

0.05

8" 230mm * 100M

 12" 330mm *100M

 


Applications

● Protective tape used in wafer backside polishing process.


Properties

Test Items

Value

Test Method

Adhesion to Steel  (g/25mm) 

100±20

JISZ0237 8

Peel Strength(g/25mm)

<10

Temperature(℃)

-10~120

Thermometer

Transmittance(%)

85±10

ASTM  D1003

Elongation(%)

MD

>650

ASTM-D638

TD

>550

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