Products
- Protective Film
- Double Sided Tape
- Decoration
- EMI Shielding & Heat Dissipation Films
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- Wafer
- PCB/FPC
- Conductive
5P165U UV off Package Dicing Tape

Features
● After UV irradiation, no adhesive residue after tearing tape.
● Easy to stretch and easy to pick up chips.
● It is made in 1000 level clean rooms to reduce ion and particulate pollutions.
Structure

|
Adhesive |
Total Thickness(mm) |
Release Film(mm) |
SPEC |
|
Acrylic |
0.165 |
0.05 |
8" 300mm * 100M |
|
12" 400mm *100M |
Applications
● It is suitable for fixed operation and protection in cutting process of semiconductor, electronic component, optical component and glass manufacture.
Properties
|
Test Items |
Value |
Test Method |
|||
|
Adhesion to Steel (g/25mm) |
Before UV |
1400±200 |
JISZ0237 8 |
||
|
After UV |
10s |
<25 |
|||
|
20s |
<15 |
||||
|
30s |
<10 |
||||
|
Tensile Strength (PSI) |
MD |
>4000 |
ASTM-D638 |
||
|
TD |
>3000 |
||||
|
Elongation (%) |
MD |
>650 |
|||
|
TD |
>550 |
||||
|
Transmittance(%) |
>85 |
ASTM D1003 |
|||

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