Features

● High-precision coating, the coating thickness is uniform.

● With PI substrate and silicone, high temperature resistance.

● Attach or tear film without preheating.

● After tearing the film, no residue.

Structure

Applications

● Prevents resin leakage when molding semiconductor packages or electronic components.

● It plays a role in temporary fixing, shielding, protection and transportation of parts in the heating process.

Properties