Products

5I35S QFN Carrier Tape

Features

● High-precision coating, the coating thickness is uniform.

● With PI substrate and silicone, high temperature resistance.

● Attach or tear film without preheating.

● After tearing the film, no residue.


Structure

5I35S_Eng.jpg

Adhesive

Total Thickness(mm)

Release Film(mm)

Width (mm)

Silicon

0.035

0.075

72mm * 100M


Applications

● Prevents resin leakage when molding semiconductor packages or electronic components.

● It plays a role in temporary fixing, shielding, protection and transportation of parts in the heating process.


Properties

Test Items

Test Value

Test Method

Substrate Thickness

mm

0.025

Thickness Gauge

Silicon Thickness

mm

0.01

Adhesion (g/50mm)

SUS 304

150

JISZ0237 8

Copper

152

Ni/Pd/Au

142

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